• Home
• Content
  • Current Issue of JZUS-A
  • Current Issue of JZUS-B
  • Current Issue of FITEE
  • Current Issue of BDM
  • Back Issue of JZUS-A
  • Back Issue of JZUS-B
  • Back Issue of FITEE
  • Back Issue of BDM
  • In Press of JZUS-A
  • In Press of JZUS-B
  • In Press of FITEE
  • In Press of BDM
  • Highlights archive of JZUS-A
  • Highlights archive of JZUS-B
  • Highlights archive of FITEE
• Submit/Guide
  • Preparing Manuscript
  • Online Submission
  • Revision&Acceptance
  • Download
• Reviewer
  • Int'l Reviewer
  • Guidelines
• Ed. Board
  • JZUS-A
  • JZUS-B
  • FITEE
  • BDM
• Service
  • Polishing
  • Crosscheck
  • Advertisement
  • Conf. info.
  • Subscription
• Top 10 Rank
  • Top 10 Cited
  • Top 10 Downloads
• About
  • Policy
  • Awards
  • Editor Papers
  • Events
  • E-linK
  • Thanks Card
  • Contacts
• Subscribe
  • Issue Subscription

index	Title
1	A high-isolation coupled-fed building block for metal-rimmed 5G smartphones Author(s):Aidi REN, Chengwei YU, Lixia YANG,...  Clicked:577  Download:869  Cited:0  <Full Text>  <PPT> 162 Frontiers of Information Technology & Electronic Engineering  2023 Vol.24 No.11 P.1657-1664  DOI:10.1631/FITEE.2300203

Journal of Zhejiang University-SCIENCE, 38 Zheda Road, Hangzhou 310027, China
Tel: +86-571-87952783; E-mail: cjzhang@zju.edu.cn
Copyright © 2000 - 2024 Journal of Zhejiang University-SCIENCE